Automatic silicon wafer invisible cutting equipment
Model：Laser Grooving LFL-AB1200
Scope of application：MEMS、RFID、Image sensor
Model：Laser Grooving LFL-AB1200
Scope of application：MEMS、RFID、Image sensor
Laser stealth cutting is a cutting method that focuses the laser on the inside of the silicon wafer, forms a modified layer inside the silicon wafer, and divides the workpiece into chips by expanding the adhesive film.
01. Anhydrous process
02. No dust
03. Fast cutting speed
04. Zero cutting loss
05. High wafer strength after cutting
06. Direct cutting of ultra-thin round crystals
07. No static electricity is generated during cutting
| Laser power | ≥15W（Measured about 18W） | ||
| Y-axis of linear motor | Stroke: 440mm | Stepping：1um | Resolution：1um |
| X-axis of linear motor | Stroke: 700mm | Stepping：1um | Resolution：1um |
| Z axis | Stroke: 20mm | Stepping：1um | Resolution：1um |
| θ axis | Stroke: 220° | Stepping：0.001° | Resolution：0.001° |
| Machining dimension | Maximum 12inch (300mm) | ||
| Scribing mode | SD implicit cut | ||
Cooperate with us to restore the appearance of your product blueprint!
Contact us
Tel：18651420821
Web：www.mxjhhs.com
Email：lumi_server@lumilaser.com
Address：Building 4, Northwest District, nano City, No. 99, Jinjihu Avenue, Suzhou Industrial Park
Copyright ? 2018 lumi laser. All rights reserved. Suzhou Laiming Laser Technology Co., Ltd ICP：蘇ICP備2021045377-1
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